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Other machines

Equipment for which press technology is applied and specialized for various industries

Applying our unique pressing technology, we develop and manufacture equipment for cutting prepregs (carbon fiber in which unset thermosetting resin is impregnated), laminating IC cards and continuously laminating printed circuit board materials. We deliver equipment related to laminating and specialized for each industry to the world.

Introduction to products

Prepreg cutting machine

  • Kitagawa Seiki's unique technology reduces scattering of resin chips and prevents breakage of resin edges.
  • Damage due to cutting dust being carried over to the next process minimized.
Cutting method
Longitudinal cutting: Slitting
Lateral cutting: Shearing
Max. PP size
Sheet material: Max. diameter: 550mm
Max. width: 1,270mm
Paper tube: Max. bore: 75mm
Max. width: 1,360mm
Cutting size
Longitudinal cutting: 300 to 1,270mm
(maximum 4 divisions)
Lateral cutting: 350 to 2,500mm
 (length)
Max. processing capacity
30 m/minute
 (for lateral cutting length of 2,500mm)

Press machine for laminating IC cards

Kitagawa Seiki’s unique technology enables fully automatic and mass-production of IC cards.
Press capacity
2 to 200kN (0.2 to 20tons)
Size of heating plate
560 x 570 x 50mm
Daylight
200mm
Number of openings
Single opening
Maximum operating temperature
230°C
Heating method
Heating by thermal oil circulation,
heating by electric heater
Reachable vacuum degree
1.3kPa (10torr)

Continuous laminating press for printed circuit board materials

Kitagawa Seiki's unique technology enables continuous production of products by intermittent laminating of thermosetting resins.
Press capacity
18,800kN (1,920tons)
Size of heating plate
600 x 4,900 x 50mm
Daylight
200mm
Maximum operating temperature
220°C
Heating method
Heating by thermal oil circulation,
heating by electric heater
Accessories
Roll-out and roll-up units
Other equipment

Press machine for making doors, press machines for making electrostatic chucks
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